Thermal Adhesive is a type of thermally conductive glue used for electronic components and heatsinks. Thermal adhesive paste is similar to thermal paste in that it is used for transferring heat from one surface to another. It is commonly used to bond heatsinks to motherboard chipsets and video card processors where there are no mounting holes to clamp a heatsink down. Thermal adhesives are not recommended to be used between a CPU and a heatsink, to which thermal grease is used. HY910 is designed to significantly enhance the cooling capacity of RAM and VR heatsinks on your CPU and VGA cards with long-lasting and reliable performance. Because it is electrically non-conductive it eliminates the risk of short-circuits and hence ensures your CPU or VGA card is working under a safe environment with rapid dissipation. This is very easy to apply and users can control the amount of application according to their needs. Despite it being an adhesive, removal is as easy as a thermal pad, without leaving residue behind.
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